| Abstract |
| We have developed an encapsulation technology for OLED devices using an LMPA sealing line to enhance barrier characteristics against moisture and oxygen penetration. To verify the potential of this technology for flexible OLED devices, three experimental factors were investigated in this study. First, the stability of the sealing line on the flexible substrate after repetitive bending was investigated by measuring changes in line resistivity. Secondly, temperature evolution and distribution on the flexible substrate during thermal processes were investigated. Thirdly, an OLED sample with the edge sealing line was manufactured and the lifetime was compared with a reference sample. The results showed the potential value of the LMPA sealing line to enhance the reliability and lifetime of flexible OLED devices.
(Received October 1, 2018; Accepted February 11, 2019) |
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| Key Words |
| OLED(Organic light emitting diode), sealing, encapsulation, LMPA, Cu(Copper) |
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