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Vol.56, No.12, 861 ~ 870, 2018
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| Title |
| Effect of Shear Deformation During Drawing on Inhomogeneous Microstructures and Textures in High Purity Copper Wires After Annealing |
| 박현 Hyun Park , 김상혁 Sang-hyeok Kim , 김세종 Se-jong Kim , 이효종 Hyo-jong Lee |
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| Abstract |
| To determine the origin of the inhomogeneous microstructure and texture observed in drawn and annealed high purity copper wires, two kinds of drawing process conditions and their influence was investigated. The regular condition, based on a symmetric die, and a condition designed intentionally to produce an inhomogeneous shear deformation using an asymmetric die were employed. The difference in intensity of <111>-<100> distributed texture between the two wires confirmed that the wire drawn under the asymmetric die condition experienced a higher amount of shear deformation. The extensive shear strain in the wire drawn under the asymmetric die condition gave rise to inhomogeneous primary and secondary recrystallization behavior. After annealing at 200 ℃, grains with <100> texture, which were larger than the surrounding recrystallized grains, were extensively present on one half circle of the wire drawn under the asymmetric die condition, while larger grains with <100> were sparsely observed around the middle region of the wire drawn under the regular condition. Interestingly, the area where the larger grains with <100> texture existed was identical to the area where the high shear strain occurred during drawing in both wires. During annealing at 400 ℃, grains with <112> texture started to grow abnormally at the center of both wires as a result of secondary recrystallization. After annealing at 900 ℃ grains with <112> due to secondary recrystallization occupied the entire region of the wire drawn under the regular condition. On the other hand, in the wire drawn under the asymmetric die condition and then annealed at 900 ℃, the <100> oriented grains as a result of the normal grain growth of the larger <100> grains which were observed after annealing at 200 ℃, coexisted with the abnormally grown <112> grains. These results indicate that dynamic recrystallization induced by the shear strain during drawing plays an important role in the inhomogeneity of the microstructure and texture of wires after annealing.
(Received September 12, 2018; Accepted October 8, 2018) |
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| Key Words |
| high purity copper, wire drawing, annealing, microstructure, texture |
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