| Abstract |
| This study examined the effects of the Sn content in a pure active metal filler Ag-Cu-Ti for the brazing of a Cu/ Al2O3 joint. The optimal content of Sn to effectively wet alumina was 5 wt%. The microstructure of the brazed joint showed the presence of an Ag-rich matrix and a Cu-rich phase, and Cu- Ti intermetallic compounds were observed along the bonded interface. The intermetallic compounds (IMCs) in the filler are found to increase when the Sn content in the alloy approaches to 10 wt%. These results suggest an extremely significant bonding strength of Cu/Al2O3 joint using the Ag-Cu-Ti+Sn filler. The shear strength of the brazed joint increased with Sn content up to 5 wt%, reaching a maximum at ?15 MPa. In addition, the strength decreased when the Sn content was higher than 5 wt%. |
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| Key Words |
| metal, active brazing, diffusion, intermetallic compounds, alumina |
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