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Vol.55, No.6, 372 ~ 379, 2017
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| Title |
| Growth Behavior of Intermetallic Compound in Dissimilar Al-Cu Joints Under Direct Current |
| 김정익 Jeong-ik Kim , 진성우 Sung-woo Jin , 정진욱 Jinwook Jung , 성현민 Hyun-min Sung , 정혜진 Hye-jin Jeong , 박시욱 Siwook Park , 박주원 Ju-won Park , 한흥남 Heung Nam Han |
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| Abstract |
| Aluminum conductors are increasingly replacing copper because Al has lower cost and lighter weight, and consequently the demand for Al-Cu joints for industrial applications is growing. However, an intermetallic compound is known to grow at the Al-Cu interface, and will result in fracture if it grows above a critical thickness. It has been reported that the thickness of this intermetallic compound layer significantly increases when alternating current flows through the Al-Cu interface. For long distance power transmission, direct current is preferred because it reduces energy losses. In the present study, the formation and growth of the intermetallic compound under direct current was investigated using FE-SEM and EPMA. The thickness of the intermetallic compound was measured and compared based on the direction of the electron flows. It was thus confirmed that under commercial conditions below 10A/㎟ the electric current accelerates the growth of the intermetallic compound, with distinct effect from electromigration. In addition, an empirical equation to predict the thickness of the intermetallic compound was obtained, to estimate the life time of the Al-Cu joint.
(Received December 8, 2016; Accepted January 3, 2017) |
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| Key Words |
| conductors, intermetallics, joining, welding, diffusion, direct current |
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