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Vol.55, No.3, 165 ~ 173, 2017
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| Title |
| Influence of Nickel Thickness and Annealing Time on the Mechanical Properties of Intermetallic Compounds Formed between Cu-Sn Solder and Substrate |
| 김이슬 Yiseul Kim , 권지혜 Jeehye Kwon , 유다영 Dayoung Yoo , 박성규 Sungkyu Park , 이다정 Dajeong Lee , 이동윤 Dongyun Lee |
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| Abstract |
| Intermetallic compounds (IMCs) developed on the interface between a solder alloy and its bonding pads are an important factor in the failure of electronic circuits. In this study, the mechanical behaviors of the IMCs formed in the Cu-Ni-Sn ternary alloy system are investigated. Presumably, Ni can act as a diffusion barrier to Cu and Sn to form the IMCs. Detailed analysis of the microstructure is conducted using an electron probe micro-analyzer (EPMA). The addition of Ni softened the IMCs, which is determined based on the fracture toughness increasing (from 0.71 to 1.55 MPa√m) with the Ni layer thickness. However, above a critical amount of Ni involved in the Cu-Sn IMCs, the softening effect is diminished, and this could result from the segregation of Ni inside the IMCs. Therefore, the optimized condition must be determined in order to obtain a positive Ni effect on enhancing the reliability of the electronic circuits. (Received July 22, 2016; Accepted December 13, 2016) |
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| Key Words |
| Pb-free solder; Intermetallic compound; mechanical properties, nanoindentation |
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