| Abstract |
| In this study the effects of Bis(3-Sulfo-Propyl)di-Sulfide (SPS) on the elongation, surface morphology and crystal structure of electrolytic copper foil were investigated. Additives HEC (hydroxyethyl cellulose) (A), SPS(B), Coll-A(C) were used in the study, and the additive used as D was a Cl- ion. The study results show that there are large differences in surface roughness and elongation depending on the amount of SPS added, from 0 ppm ~ 40 ppm. In this study, it was verified that the SPS additive plays the role of an accelerating agent, and makes it possible to control grain sizes. Also, the elongation rate increased, with increasing amounts of SPS. In addition, it was determined that SPS improves both the grain size and elongation rate due to its effect on the crystal structure. The addition of 40 ppm SPS resulted in a low surface roughness of less than 1 μm, and the sample showed both low tensile strength and large grain size. Here, the elongation was 9.0%, (Received October 13, 2015; Accepted March 29, 2016) |
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| Key Words |
| electroplating, copper, organic additive, elongation, surface morphology. |
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