| Abstract |
| We suggest a new OLED encapsulation method involving an LMPA-epoxy double line structure using joule heating. First, an underlayer that consists of a heating layer, an insulating layer, and a sacrificial layer was manufactured in the form of a line with 0.5 mm width and thousands of Å thickness. A mixture of Sn-58Bi and UV curing epoxy was then printed over the underlayer pattern. Applying 5.8 W of electrical power on the heating layer for 60 seconds, Sn-58Bi was separated from the epoxy. The LMPA-epoxy double line structure was stabilized and sufficient adhesion strength between the two substrates was secured by UV curing. The thickness of the Cu sacrificial layer and the content of the epoxy in the mixture were optimized through experiments. (Received August 11, 2014) |
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| Key Words |
| alloys, annealing, melting, scanning electron microscopy (SEM), organic light emitting diode, OLED |
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