| Abstract |
| The temperature of the MPCB of a 16-chip LED package (TB) was kept at 25℃, 50℃ and 75℃ using a Peltier element and compared with natural cooling conditions. The junction temperature (TJ) was measured by a thermal transient method. A heat transfer model is proposed to investigate the heat flux through the three heat dissipation paths, upward, sideward and downward, and to predict the temperature distribution inside the LED package. The results showed that, with 4.8 W of input power applied, TJ decreased dramatically from 115℃ to 38℃ by keeping TB at 25℃ due to the elimination of the heat convection resistance at the MPCB surface. It was predicted that a maximum of 28 W could be applied to the package by keeping TB at 25℃ under the constraint condition that the junction temperature of the LED not exceed 100℃. |
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| Key Words |
| optoelectronic materials, thermomechanical processing, thermodynamic properties, thermal analysis, thermal transient analysis |
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