| Abstract |
| It is extremely important that the junction temperature of a high-power, multi-chip LED package be managed so as not to exceed the allowable temperature range (-40-100℃) due to the large heat dissipated from the package. In this study, chip configuration was modified in a 4-chip LED package, and the number of chips was changed to 12-chip and 16-chip packages to investigate their effects on the thermal characteristics of the packages. Thermal resistance was estimated using thermal transient analysis, and the ambient temperature of the package was measured by thermo-couple. Ultimately, the junction temperatures of the packages were obtained using these data. The results showed that the maximum allowable input power of the 4-chip package was 3.4 W, which was enlarged up to 5.5 W using 12-chip and 16-chip LED packages. (Received July 10, 2012) |
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| Key Words |
| optoelectronic materials, thermomechanical processing, thermodynamic properties, thermal analysis, LED Package |
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