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Vol.48, No.10, 951 ~ 957, 2010
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| Title |
| Effect of Electrolyte Compositions on the Physical Property and Surface Morphology of Copper Foil |
| 우태규 Tae Gyu Woo , 박일송 Il Song Park , 전우용 Woo Yong Jeon , 박은광 Eun Kwang Park , 정광희 Kwang Hee Jung , 이현우 Hyun Woo Lee , 이만형 Man Hyung Lee , 설경원 Kyeong Won Seo |
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| Abstract |
| This study examined the effect of copper and sulfuric acid concentrations on the surface morphology and physical properties of copper plated on a polyimide (PI) film. Electrochemical experiments with SEM and a four-point probe were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the composition of an electrolyte. The resistivity and peel strength were controlled using a range of electrolyte compositions. A lower resistivity and high flexibility were obtained when an electrolyte with 20 g/l of copper was used. However, a uniform surface was obtained when a high current density that exceeded 20 mA/cm² was applied, which was maintained at copper concentrations exceeding 40 g/l. Increasing sulfuric acid to >150 g/l decreased the peel strength and flexibility. The lowest resistivity and fine adhesion were detected at a Cu2+: H2SO4 ratio of 50:100 g/l. |
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| Key Words |
| Thin films, plating, mechanical properties, resistivity, Flexibility |
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