발간논문

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Vol.37, No.9, 1117 ~ 1124, 1999
Title
Characteristics of Composite Solder Balls Produced by an in - situ Processing Part 2 : Reflow Solderability of the Sn - Ag in - situ Composite Solder ball
허정나Jung Na Heo,이종현Jong Hyun Lee,박대진Dae Jin Park,김석윤Suk Yun Kim,신동혁Dong Hyuk Shin,김용석Yong Seog Kim
Abstract
In this study, the solderability of the in-situ composite solders was investigated by reflow soldering the solder balls on a BT substrate. The reaction characteristics of the composite solders were evaluated by observing the microstructure of the solder/BLM interface. Also the effects of the number of reflow soldering on the microstructure and the distribution of the reinforcement were investigated. These results indicated that the composite solder has a lower reactivity with the BLM and Cu, but its thermal stability must be improved significantly for actual applications of the material.
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