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Vol.48, No.3, 248 ~ 256, 2010
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| Title |
| Microstructural Control of Al-Sn Alloy with Addition of Cu and Si |
| 손광석 Kwang Suk Son , 박태은 Tae Eun Park , 김진수 Jin Soo Kim , 강성민 Sung Min Kang , 김태환 Tae Hwan Kim , 김동규 Dong Gyu Kim |
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| Abstract |
| The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface. |
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| Key Words |
| Al-Sn, alloys, casting, wear, electron backscattering |
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