발간논문

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Vol.47, No.10, 675 ~ 681, 2009
Title
Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion of Electroless-plated Ni on Polyimide
민경진 Kyoung Jin Min , 정명혁 Myeong Hyeok Jeong , 이규환 Kyu Hwan Lee , 정용수 Yong Soo Jeong , 박영배 Young Bae Park
Abstract
Effects of 85℃/85% Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a 180° peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from 37.4±5.6 g/mm to 22.0±2.7 g/mm for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself.
Key Words
adhesion, temperature/humidity, peel test, alkali surface pretreatment, electroless-plated Ni, polyimide
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