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Vol.47, No.8, 500 ~ 508, 2009
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| Title |
| The Interfacial Reactions and Reliability of SnAgCu Solder Joints under Thermal Shock Cycles |
| 오철민 Chul Min Oh , 박노창 No Chang Park , 한창운 Chang Woon Han , 방만수 Man Soo Bang , 홍원식 Won Sik Hong |
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| Abstract |
| Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition. |
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| Key Words |
| Pb-free solder joint, reliability, Low Ag solder, thermal shock, failure mode |
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