발간논문

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Vol.47, No.1, 26 ~ 32, 2009
Title
Effect of Ion-beam Pre-treatment on the Interfacial Adhesion of Sputter-deposited Cu film on FR-4 Substrate
민경진 Kyoung Jin Min , 박성철 Sung Cheol Park , 이기욱 Ki Wook Lee , 김재동 Jae Dong Kim , 김도근 Do Geun Kim , 이건환 Gun Hwan Lee , 박영배 Young Bae Park
Abstract
The effects of Ar/O2 ion-beam pre-treatment conditions on the interfacial adhesion energy of sputter-deposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from 45.8±5.7 g/mm to 61.3±2.4 g/mm by Ar/O2 ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to Ar/O2 ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.
Key Words
adhesion, peel test, ion-beam pre-treatment, FR-4 substrate, sputter-deposited Cu
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