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Vol.46, No.1, 33 ~ 39, 2008
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| Title |
| Effect of Under Bump Metallization (UBM) on Interfacial Reaction and Shear Strength of Electroplated Pure Tin Solder Bump |
| 김유나 Yu Na Kim , 구자명 Ja Myeong Koo , 박선규 Sun Kyu Park , 정승부 Seung Boo Jung |
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| Abstract |
| The interfacial reactions and shear strength of pure Sn solder bump were investigated with different under bump metallizations (UBMs) and reflow numbers. Two different UBMs were employed in this study: Cu and Ni. Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) were formed at the bump/Cu UBM interface, whereas only a Ni3Sn4 IMC was formed at the bump/Ni UBM interface. These IMCs grew with increasing reflow number. The growth of the Cu-Sn IMCs was faster than that of the Ni-Sn IMC. These interfacial reactions greatly affected the shear properties of the bumps. |
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| Key Words |
| Flip chip, pure tin (Sn), under bump metallization, UBM, multiple reflows, interfacial reaction, shear test, intermetallic compound, IMC |
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