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Vol.45, No.11, 628 ~ 635, 2007
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| Title |
| The Effect of Anodic Oxidation Condition of Titanium Substrate on the Surface Morphology and Crystal Structure of Electrodeposited Copper |
| 박은광 Eun Kwang Park , 이만형 Man Hyung Lee , 설경원 Kyeong Won Seol , 우태규 Tae Gyu Woo , 박일송 Il Song Park |
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| Abstract |
| Recently, requirerr ent for the ultra thin copper foil increase with smaller and miniaturized electronic components. A study has been made to determine the effect of an electrochemically produced titanium-oxide film on the surface morphology and crystal structure of copper. The oxide films were made current step and potential step at 20℃ in 1.5M sulfuric acid on pure titanium metal. The formation of a microporous oxide layer enhances the surface morphology of copper foil. When a copper foil was electroplated on the polished titanium surface, large particles were existed on the surface of the copper film deposited. However, a smooth surface was obtained when the 130V anodized surface was used. The minimum value of surface roughness(Ra) was 0.254μm. |
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| Key Words |
| electrodeposition, copper foil, titanium anodizing, TiO2 |
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