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Vol.45, No.9, 520 ~ 527, 2007
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| Title |
| Effect of Temperature/Humidity Treatment Conditions on the Interfacial Adhesion Energy of Inkjet Printed Ag Film on Polyimide |
| 박성철 Sung Cheol Park , 조수환 Su Hwan Cho , 정현철 Hyun Cheol Jung , 정재우 Jae Woo Joung , 박영배 Young Bae Park |
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| Abstract |
| Effects of 85℃/85%RH(T/H) treatment conditions on the interfacial fracture energy of inkjet printed Ag/Polyimide system are investigated from 180° peel test by calculating the peeling deformation energy of peeled metal and polyimide films. Interfacial fracture energy between inkjet printed Ag and polyimide was initially around 28.0 g/mm, while the increase in T/H treatment times as 76, 196, and 388 hrs lead to initial increase up to 78.9 g/mm and then decrease to 56.4 and 44.3 g/mm, respectively. Ag-O-C bonding formation seems to be responsible for interfacial adhesion improvement in the initial T/H treatment while moisture penetration inside polyimide itself seems to be related to the decrease in interfacial adhesion for longer T/H conditions. |
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| Key Words |
| adhesion, temperature/humidity, peel test, inkjet printed ag, polyimide |
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