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Vol.45, No.8, 478 ~ 484, 2007
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| Title |
| The Effect of Surface Morphology and Crystal Structure on the Thickness of Copper Foil |
| 박은광 Eun Kwang Park , 이만형 Man Hyung Lee , 설경원 Kyeong Won Seol , 우태규 Tae Gyu Woo , 박일송 Il Song Park |
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| Abstract |
| This study aimed to investigate the effects of thickness and heating temperature on the surface characteristics and electric characteristic of copper foil. The copper foils with 5, 10, 20, and 25μm thick were formed by electrodeposition in the electrolyte composing of Cu 100g/L and H2SO4 100g/L at 200mA/cm2. In addition, the RTA(rapid thermal annealing) was executed by using 10μm thick copper foil. SEM, XRD, AFM and four-point probe were performed to characterize the morphology and electric characteristics of copper foil. The crystal size and surface roughness increased with the increasing thickness of copper foil. The minimum specific resistance was observed in the electrodeposited copper foil with 15μm thick. After RTA treatment of 10μm thick copper foil, the lowest value of specific resistance (2.03 μΩ-cm) and surface roughness (176.3 nm) was measured in the group treated 300℃, respectively. Especially, it is expected that the RTA treatment at 300℃ is good for increasing resistance of electromigration. |
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| Key Words |
| copper thickness, heating treatment, surface characteristics, resistivity |
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