| Abstract |
| Using electrodeposition, the influence of Re on thermal stability of Ni-P films was studied. Ni-P and Ni-Re-P films were electrodeposited on Cu plates in a sulfamate bath respectively. Electrodeposition was carried out at 1A/dm2 and the film`s thickness was 170nm. The concentration of P and Re in the films was analyzed by WDXRF(Wave Dispersive X-ray Fluorescence Spectrometers) and the concentration was 6wt.% and 10wt.% respectively. DSC(Differential Scanning Calorimetry) and XRD(X-ray diffraction) showed that the crystallization temperature of Ni-Re-P films was 76℃ higher than that of Ni-P films. The results indicated that the thermal stability of Ni-Re-P films was superior to that of Ni-P films. |
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| Key Words |
| diffusion barrier, Cu diffusion, thermal stability, Ni-P electrodeposition, Ni-Re-P electrodeposition |
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