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Vol.44, No.8, 581 ~ 587, 2006
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| Title |
| Wellding & Joining ; Evaluation of Thermo-mechanical Reliability of Flip Chip Solder Joints(1): 1. Pb-bearing Solder |
| 김종웅 Jong Woong Kim , 김대곤 Dae Gon Kim , 하상수 Sang Su Ha , 문원철 Won Chul Moon , 유충식 Choong Sik Yoo , 문정훈 Jeong Hoon Moon , 정승부 Seung Boo Jung |
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| Abstract |
| The microstructural investigation and thermo-mechanical reliability evaluation of the conventional Sn-37Pb solder bumped flip chip package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between the solder and Cu mini bump of the chip side was Cu6Sn5 IMC layer, while a layer of Ni3Sn4 was formed between the solder and electroless Ni-P layer of the package side. The primary failure mechanism of the solder joints in this type of test method and package was confirmed to be thermally activated solder fatigue failure. The brittle interfacial failure mode was sometimes detected from the cross-sectional studies, but nearly whole of the failed packages showed the occurrence of the typical fatigue cracks. |
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| Key Words |
| Pb-bearing solder, Flip chip, Reliability, Fatigue |
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