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Vol.44, No.8, 575 ~ 581, 2006
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| Title |
| The Effect of Additives and Current Density on the Copper Electrodeposition using Galvanostatic Mode |
| 우태규 Tae Gyu Woo , 설경원 Kyeong Won Seol , 이현우 Hyun Woo Lee , 박일송 Il Song Park , 윤영민 Young Min Yoon , 윤정모 Jeong Mo Yoon , 우경녕 Kyeong Nyong Woo |
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| Abstract |
| The purpose of this study is to identify the effect of additives and current density on initial copper nucleation and growth during copper electrodeposition. Additives such as chloride ions, arabic gum were used in this study. An EG&G PAR model 273A potentiostat/galvanostat connected to a microcomputer with the M270 software was used for the electrochemical tests. Electrochemical experiments allied to SEM and image analysis were performed to characterize the nucleation and growth of copper in the presence of additives. In the higher current density, the copper foil had more uniform crystal size, higher surface covering and less needles shape crystals compared to lower current density. In the production of electrodeposited copper foil, grain size of the copper foil can be controlled by adding appropriate combination of additives. |
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| Key Words |
| Electrodeposition, Arabic gum, Chloride ions, Nucleation, Copper foil |
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