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Vol.44, No.7, 503 ~ 511, 2006
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| Title |
| Effects of Heat Treatment on Thermoelectric Properties of TiNiSn Half-Heusler Compound |
| 김성웅 Sung Wng Kim , 홍성길 Sung Kil Hong , 최답천 Dap Chun Choi , Yoshisato Kimura , Yoshinao Mishima |
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| Abstract |
| A class of intermetallics of MNiSn (M=Ti, Zr Hf) half-Heusler compound is currently of interest as a promising thermoelectric material for application to power generation in high temperature range. We have studied the high temperature thermoelectric properties of TiNiSn half-Heusler compound. The present study reports the effect of heat treatment on high temperature thermoelectric properties of TiNiSn half-Heusler compound. It is shown that the transport properties of TiNiSn compound change from metallic to semiconducting by heat treatments. From the evaluation of microstructure, Seebeck coefficient, electrical resistivity and band gap for the heat-treated TiNiSn compounds, it is revealed that the heat treatment at 1073 K for 2 weeks is the optimum condition. This finding facilitates the research aiming the enhancement of high temperature thermoelectric properties of TiNiSn-based half-Heusler compounds. |
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| Key Words |
| TiNiSn half-Heusler compound, Heat treatment, Thermoelectric properties, Band gap |
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