| Abstract |
| Electronic industry makes constant effort to replace the Pb bearing solder with the lead-free solder, because of the growing tendency of being intensified the environmental regulation of the use of lead. It is not yet classified for the evaluation method of mechanical properties such as the shear strength for the lead-free solder paste. Solder joint was made in this research by reflow method with the solder paste Sn-3.0Ag-0.5Cu. In order to standardize the shear test method, the shear strength of solder joint of 2012 ceramic chip was measured at the shear speed of 25 mm/min using with the various shapes of shear jigs. The optimum number of shear test specimens was statistically analysed by the calculation of accumulation average value, standard deviation, and the width of confidence interval. The suitable range of jig height on the ceramic chip was obtained by testing with various location of jig. The fracture surface of solder joint was analysed using by SEM. |
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| Key Words |
| Standardization, Shear test, 2012 Ceramic chip, Lead-free Solder paste |
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