| Abstract |
| Ball shear tests for ball grid array (BGA) solder ball joints were investigated in terms of the effects of test parameters, i.e., shear height and shear speed. Two kinds of Pb-free solder compositions were employed in this study: Sn-3.5Ag-0.75Cu and In-48Sn. Substrate was a common solder mask defined (SMD) type with solder bond pad openings of 460 ㎛ in diameter. Shear tests were conducted with the two varying test parameters. It was observed that increasing shear height at a fixed shear speed has the effect of decreasing shear force for both Sn-3.5Ag-0.75Cu and In-48Sn solder joints, while the shear force increased with increasing shear speed at a fixed shear height. It should be noted that the shear forces of In-48Sn solder joints were more highly affected by the shear speed rather than those of Sn-3.5Ag-0.5Cu solder joints. Shear heights that were too high had some negative effects on the test results such as unexpectedly high standard deviation values or shear tip sliding from the solder ball. Low shear height conditions were favorable for screening the type of brittle interfacial fractures or the degraded layers in the interfaces. |
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| Key Words |
| Shear height, Shear speed, Finite element analysis, Pb-free solder, Ball grid array |
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