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Vol.44, No.2, 129 ~ 136, 2006
Title
Si Carrier Fabrication Using Si Anisotropic Property and the Application of Fine Pitch for Flip Chip Solder Bump
이규하 Kyu Ha Lee , 오은주 Eun Ju Oh , 홍성표 Sung Pyo Hong , 서창제 Chang Chae Shur
Abstract
As the demand for flip chip products increases, the need for high volume, low cost manufacturing processes also increases. Currently solder paste printing is the solder deposition method of choice for device pitches down to 200 ㎛. However limitations in print quality and solder paste volume mean that this technology is not likely to move below this pitch. This paper provides transformation method of flip chip solder bump manufacturing using Si carrier. 150 ㎛ solder bump was formed by this method.
Key Words
Flip chip, Transformation, Si carrier
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