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Vol.43, No.3, 240 ~ 248, 2005
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| Title |
| Analysis on Formation Process of Failure Locus of Leadframe/EMC Interfaces Formed by Pull-out Test |
| 이호영 Ho Young Lee , 박영배 Young Bae Park , 전인수 In Su Jeon , 김용협 Yong Hyup Kim |
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| Abstract |
| Two types of copper-oxide layers were formed on the surface of a copper-based leadframe sheets by immersing them in two kinds of hot alkaline solutions. The oxide-coated leadframe sheets were molded with EMC (Epoxy Molding Compound), and the molded bodies were machined to form pull-out specimens for the purpose of measuring the adhesion strength between oxide-coated leadframe and EMC. After the pull-out tests, fracture surfaces were analyzed using various techniques to find out the failure loci, and subsequently, finite element modeling was carried out to simulate failure loci forming process. The results revealed that phase angle is a main factor affecting failure locus. Local phase angle changes resulted in locally different failure loci. (Received November 26, 2004) |
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| Key Words |
| Leadframe, Epoxy, Adhesion, Failure Locus, Phase angle |
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