발간논문

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Vol.36, No.12, 2102 ~ 2111, 1998
Title
Microstructural Stability and Strengthening Mechanism of Cu-15Nb Filamentary Microcomposites (1) Microstructural Stability
임문수 , 홍순익 Moon Su Lim , Sun Ig Hong
Abstract
The microstructural stability of Cu-Nb filamentary microcomposites wires fabricated by the bundling process were examined using TEM(Transmission Electron Microscope). The cross sectional shape of most Nb filaments in bundled wires appear straight with slight curvature. Nb filaments were distributed rather randomly and extremely irregular or heavily kinked Nb filaments were distributed to the cylinderization of Nb filaments during bundling process at high temperature. No flaws were observed near interface regions between subelemental wires and copper sheath, suggesting excellent bonding was promoted by copper sheath. Nb atoms were dissolved and numerous Nb precipitate were found to be formed in copper channels during bundling process. Twins were occasionally observed to have a twin relationship, indicating Nb filaments are strong barriers to twin propagation.
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