| Abstract |
| The microstructure of Cu-15 wt%Nb filamentary nanocomposite fabricated by the bundling and drawing process were characterized using high resolution electron microscopy and the computer-aided image processing. Nb filaments were randomly distributed throughout the copper matrix and appeared to be straight or slightly curved in the bundled wires. The copper grain is observed in a <110> zone axis while two differently oriented grains are found in the niobium filaments, a first grain being observed in a <111> direction, the other in a <001> zone axis. The semi-coherent interface with periodic misfit dislocations was formed to have {002}_(Cu)||{110}_(Nb), <100>_(Cu)||<110>_(Nb) orientation relationship and the interface was parallel to <100>_(Cu). The micro-twins having {112} twin planes were observed in a few niobium filaments. |
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| Key Words |
| Cu-Nb filamentary nanocomposite, High resolution electron microscopy, Image processing, Interphase interface structure, Misfit dislocation, Twin structure |
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