|
Vol.41, No.7, 439 ~ 445, 2003
|
| Title |
| Evaluation of the Process and Size Effects on the Fracture Strcngth of Single-crystal Si Using the Microtensile Test |
| 이성훈 Lee Sung Hun , 김종진 Kim Jong Jin , 정증현 Jeong Jeung Hyun , 김동원 Kim Dong Won , 권동일 Kwon Dong Il |
|
|
|
| Abstract |
| The process and size effects on the fracture strength of single-crystal Si were evaluated using a microtensile testing method. The microtensile specimens of single-crystal Si films were fabricated by CMP(chemical-mechanical polishing) and micromachining processes, The microtensile test setup was built to accommodate requirements such as specimen handling, jig, alignment and very small loads and displacements. The variations in the fracture strength with thickness and effective volume of the Si film were evaluated. In addition, the results were discussed statistically. The effects of dry-etched surface and CMP surface on the mean fracture strength were compared. Through AFM (atomic force microscopy) observation, it could be found that the larger flaws of the dry-etched surface affected significantly on the decreasing of the mean fracture strength. |
|
|
| Key Words |
| Fracture Strength, Microtensile test, Single-crystal Si, Size effect, Process effect |
|
|
 |
|
