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Vol.41, No.6, 350 ~ 355, 2003
Title
Electrochemical Reliability of Plasma-Polymerized Thiophene Films in Microelectronic Devices
김정구 Jung Gu Kim , 박진택 Zin Taek Park , 최윤석 Yoon Seok Choi , 부진효 Jin Hyo Boo , 유용재 Yong Jae Yu
Abstract
The corrosion failure of electronic devices has been a major reliability concern lately. This failure is an ongoing concern because of miniaturization of integrated circuits(IC) and the increased use of polymers in electronic packaging. In this paper plasma-polymerized thiophene films were considered as a possible candidate for an interlayer dielectric for multilever metallization of ultra large scale integrated (ULSI) semiconductor devices. The protective ability of above films as a function RF power in an 3.5 wt.% NaCl solution was examined by electrochemical methods and contact angle measurement. The protective efficiency of the film increased with increasing RF power, which induced the higher degree of cross-linking and hydrophobicity of the films.
Key Words
Corrosion, Plasma enhanced chemical vapor deposition, PECVD, Thiophene film
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