| Abstract |
| Increased electronic packaging density requires thermal management materials with high thermal conductivities and low coefficients of thermal expansion (CTEs) matching those of ceramic substrates or semiconductors. Recently, metal matrix composites (MMCs) have been developed, which provide unique combination of properties that make them candidates for thermal management materials. Most of conventional processes to fabricate MMCs have complicated steps that reduce the cost effectiveness, such as the infiltration process requiring a preform preparation and long process time. Plasma spraying can be adopted to produce MMCs in a flexible and cost effective manner. In this study, SiC particles reinforced Al matrix composites were fabricated by atmospheric plasma spraying method. Al and SiC powders were blended and sprayed with plasma arc power. SiC were uniformly dispersed in the Al matrix with a volume fraction of up to 46%. There were also pores in the composite with a range of 1.8∼12 vol.%, which could be tailored by process parameters. The experimental CTEs showed 13.5∼17.6×10^-6/℃ for the Al-SiC composite containing about 40 vol.% SiC, which were matched well with the predicted ones. |
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| Key Words |
| Plasma spraying, Al-SiC, Composite, Electronic packaging, Coefficient of thermal expansion |
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