| Abstract |
| The microstructure of Cu-16 at%Ag filamentary nanocomposite fabricated by thermo-mechanical process has been characterized by the combined use of a high resolution electron microscopy and a computer-aided image processing. The silver filaments with a diameter of 1.5-8 nm were observed along the 〈111〉_Cu directions in the copper matrix, and the orientation relationship between the copper matrix and the silver filament was determined to be cube on cube; (100)_Cu ∥ (100)_Ag, ［010］_Cu ∥ ［010］_Ag. The interfaces between the copper matrix and the silver filament were parallel to the 〈111〉_Cu directions and the misfit dislocations were detected at interphase interfaces. In the lamellar structure region, the twin bands with a width of 6--8 nm were observed and silver filaments within the twin band also appeared twinned. A ｛111｝twin orientation relationship was found between the copper matrix and silver filament and the twin interface was parallel to the ｛111｝ twin plane. |
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| Key Words |
| Cu-16 at%Ag filamentary nanocomposite, High resolution electron microscopy, Image processing, Interphase interface structure, Misfit dislocation, Twin structure |
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