발간논문

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Vol.40, No.7, 744 ~ 752, 2002
Title
Research Papers / Mechanical Behaviors : Evaluation of Residual Stress in DLC Thin Films through the Theoretical Modeling of the Transitional Behavior in Nanocontact Morphology during Stress Relaxation
이윤희Yun Hee Lee,지원재Won Jae Ji,정증현Jeung Hyun Jeong,권동일Dong Il Kwon
Abstract
Assessment of residual stress is an important point to prevent the failures of thin film devices. Nanoindentation technique was proposed as a stress-measuring method of thin film in a previous research. However, the stress-analyzing model used at the previous research had the problems of a partial deformation-irrelative stress interaction concept and no consideration of the change in the contact area during continuous stress relaxation. Therefore, we modified the model by analyzing a new residual stress-induced normal load based on deformation-dependent shear stress component and by calculating the continuous relaxation procedure as an integration method. The modified model was applied to evaluate the residual stresses in two diamond-like carbon films. The evaluated residual stresses from the newly modified model were more consistent with the results from the conventional curvature method than those from the earlier model.
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