발간논문

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Vol.39, No.12, 1435 ~ 1445, 2001
Title
Solidification : A Study on the Copper Plate Crack in Thin Slab Funnel Mold
윤우석U Sok Yoon,박중길Joong Kil Park
Abstract
The formation of copper plate crack in thin slab funnel mold was investigated using metallographic studies and mathematical models. X-ray analyses of crack surface revealed that relatively brittle compound was formed in the copper matrix at high temperature where crack initiated. The scale deposition at cooling slot of copper plate below the meniscus was found after casting, which hindered the heat transfer between solidified shell and copper plate. To calculate the heat transfer in the mold at the high casting speed, new heat flux equation was made using measured average heat fluxes at different casting speed. Two dimensional heat transfer and stress analysis were done to investigate the temperature and stress fields associated with cracks. The high temperature during casting, and high tensile stress of copper plate after casting were found in the funnel transition region just below the meniscus, due to geometrical effect and uneven distance between hot face and cooling slot tip of copper plate. The tension bolt was removed to verify the stress concentration relief at funnel transition region and crack was decreased after test.
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