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Vol.39, No.7, 823 ~ 827, 2001
Title
A Study on the Fluxless Soldering of Sn - 37Pb and Sn - 3.5Ag Solder Using Rolling
박창배Chang Bae Park , 홍순민Soon Min Hong , 정재필Jae Pil Jung , Ndy N . Ekere , 강춘식Choon Sik Kang , D . Rajkumar
Abstract
UBM-coated Si-wafer was fluxlessly soldered with glass substrate in N₂ atmosphere using rolled solder sheet. The bulk Sn-37wt%Pb and Sn-3.5wt%Ag solders were rolled to the sheet of 100㎛ thickness in order to achieve a bonding to Si-wafer by fluxless reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin. It was possible to bond a solder disc to the Si-wafer with fluxless process in N₂ gas. Wetting angle of the fluxless soldered disc on the Si-wafer was about 9∼10°. The Si-wafer with a rolled solder was bonded to glass without flux in N₂ atmosphere. The joint was sound, and the thicknesse of intermetallic compound along the interface of Si-wafer was less than 2㎛.
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