발간논문

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Vol.39, No.7, 814 ~ 823, 2001
Title
Growth Kinetics and Growth Suppression of Au - containing Ternary Intermetallic at Solder / UBM Interface during Solid Aging
이종현Jong Hyun Lee,최병도Boung Do Choi,이용호Yong Ho Lee,김용석Yong Seog Kim
Abstract
In this study, effects of under bump metallurgy (UBM) structure and Cu content in solders on redeposition rate of Au-containing ternary intermetallics at solder/UBM interface were investigated. A UBM structure with Ni diffusion barrier, Au/Ni/Cu, appeared to promote the redeposition during solid state aging treatment, leading to an Au-embrittlement of solder interconnections. Addition of Cu into eutectic Sn-Pb and Sn-Ag solders, however, were observed to be very effective in retarding the redeposition and preventing the Au-embrittlement. These effects were discussed with the microstructures observed.
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