발간논문

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Vol.38, No.9, 1233 ~ 1240, 2000
Title
Reliability of Composite Solder Bumps Produced by an In-Situ Process
이종현Jong Hyun Lee,박대진Dae Jin Park,이용호Yong Ho Lee,신동혁Dong Hyuk Shin,김용석Yong Suk Kim
Abstract
In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu_6Sn_5 dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM(ball limiting metallurgy) interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.
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