Schottky enhancement was demonstrated experimentally by using MESFET with Ni/Al/Ni gate. Forward I-V characteristics showed that Schottky barrier height increased from 0.77 eV to 0.89 eV when the contacts were annealed at 350℃ for 15 min. From XRD analysis, we found that the ternary phases, Ni_xGaAs, were formed at 200℃ and NiAl₃ and Ni₂Al₃ phase were dominant at 325℃. As the Sohottky barrier height increased, current density level deceased at same gate voltage and the maximum transconductance, g_m , was shifted to the higher gate voltage. In addition, pinch-off voltage and threshold voltage were increased by 0.1 voltage. |
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