발간논문

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Vol.36, No.3, 348 ~ 356, 1998
Title
Mechancial Stability of Cu-25wt.%Ag Two Phase Microcomposite Wires
임문수 , 송재숙 , 홍순익 , 권훈 , 지광래 M . S . Lim , J . S . Song , S . I . Hong , H . Kwon , K . K . Jee
Abstract
The microstructure and strengthening mechanism of Cu-Ag microcomposite was examined in this paper. The high strength of Cu-Ag composite was found to be associated with the fine filamentary microstructure. Dislocation density between silver filaments decreased with decreasing spacing of filaments and the density was not high enough to explain the high strength of Cu-Ag microcomposite. The decrease of ductility in Cu-Ag microcomposites heat treated at low temperatures can be explained by the reprecipitation of small shearable silver precipitates in same regions of copper rich a phase. The spheroidization temperature was predicted assuming that the rate of growth of a sinusoidal pertubation is governed by interface diffusion, which is in good agreement with the TEM observation. The predicted strength of heavily drawn Cu-24wt.%Ag using the modified rule of mixture was 985㎫, which is also in good agreement with the tensile strength of as-drawn wires of the present study.
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