발간논문

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Vol.36, No.1, 117 ~ 123, 1998
Title
Influence of Hydrogen Reduction on Alumina / Copper oxide Eutectic Reaction Layer
이태원 , 이지환 Tae Won Lee , Chi Hwan Lee
Abstract
The microstructural evolution and sheet resistance of copper-metallized alumina substrate have been investigated in terms of calcination temperature and hydrogen reduction temperature. The paste was made by mixing Cu₂O powder with binder. The alumina substrates were screen-printed with Cu₂O paste to 50㎛ thickness and heated at the temperature range from 1050℃ to 1200℃ for 30min in air atmosphere. The hydrogen reduction was performed at the temperature range from 200℃ to 800℃ for 30min. The calcined surface was densified at the temperature range from 1150℃ to 1200℃ due to the full melting of copper oxide powders. It was observed that the morphology of hydrogen reduced surface was more porous than that of calcined surface. Also, it was found that the morphology of hydrogen reduced surface depended upon calcination temperature. The sheet resistance value of copper-metatlized alumina substrate was varied with calcination temperature and hydrogen reduction temperature
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