발간논문

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Vol.35, No.11, 1547 ~ 1555, 1997
Title
The Influence of Deposition Temperature and HN3 Pretreatment of the Adhesion of Titanium Nitride films Produce by Thermally Activated Chemical Vapor Deposition Method
김남식 , 정채오 , 이정중 N . S . Kim , C . O . Chung , J . J . Lee
Abstract
Titanium nitride(TiN) films were deposited on M2 high speed steel(HSS) by the thermally activated chemical vapor deposition using TiCl₄, NH₃, and H₂ as reactive gases at temperature range between 600 and 900℃. With increase of the deposition temperature the column site in TiN film increased, while the chlorine content decreased. The adhesion strength of the TiN films to the substrate also increased with the deposition temperature. NH₃, pretreatment at the deposition temperature was studied to enhance the adhesion of the TiN films deposited at 600℃. It has been found out that the adhesion property has been improved when the NH₃ pretreatment had been carried out at the NH, pressure of more than 5.0torr.
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