발간논문

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Vol.34, No.10, 1338 ~ 1346, 1996
Title
Research Paper - Mechanical Behavior - : Effects of Mechanical Properties of Metal Films on the Peel Strength of Cr / Polyimide Interfaces
최진원Jin Won Choi, 오태성Tae Sung Oh, 김영호Young Ho Kim
Abstract
Effects of mechanical properties of Cu/Cr metal films in Cu/Cr/polyimide structures on the peel strength of Cr/polyimide interfaces have been investigated. With increasing the yield strengths of Cu/Cr metal films from 156 MPa to 325 MPa, the peel strengths of Cr/PMDA-ODA and Cr/BPDA-PDA interfaces were lowered from 75 g/㎜ to 57 g/㎜ and from 69 g/㎜ 20 g/㎜, respectively. Compared to the peel strength of Cr/PMDA-ODA interface, the low value was obtained on Cr/BPDA-PDA interface with identical Cu/Cr metal films, indicating that the interfacical fracture toughness of Cr/BPDA-PDA is lower than the value of Cr/PMDA-ODA.
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