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Vol.34, No.3, 329 ~ 337, 1996
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| Title |
| Research Paper - Mechanical Behavior - : Effects of Ti and SiCp Addition on the Ceramic Grinding of A2219 - Bonded Diamond Wheel |
| 최정철 , 황도연 , 최성국 Jung Chul Choi , Do Yun Hwang , Sung Kook Choi |
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| Abstract |
| A2219 Al alloy was selected in use as the bonding agent for diamond grinding wheel. In order to alleviate the wetting of the Al adhesive with workpiece, Ti was added to the Al alloy for strengthening and minimizing the adhesive trouble, SiC_p for improving wear resistance. 5%Ti, 10% and 15% in weight respectively was added in 2219 Al matrix, and 149 ㎛ diamond was also added in it. Then 5wt%SiC_p was added in the matrix to find the effect of addition. The hot pressing condition was 600℃, 20Mpa and 0.6Ks in the furnace of the electric resistance type. The grinding ratio was increased with the increase of Ti, in case of grinding wheels without SiC_p. The grinding wheel with SiC_p did not show better performance than it without SiC_p. We have found the A2219 alloy bond added 15wt% Ti showed better grinding ratio than resin bond. |
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