| The vacuum brazing of AlN to Cu with Cu and Ag based brazing alloy containing Ti has been carried out to investigate the wettability and interfacial reaction. Binary Cu_(78)Ti_(22)(CT), Ag_(98)Ti₂(AT) alloys and ternary CT-5wt.%X, AT-1wt.%X(X=Al, Ni, Mn) alloys showed good wettability on AlN and led to the formation of TiN layers at the interface. 4-point bend strength of the joint has increased with bonding temperature and showed maximum value, and then decreased with temperature. The highest bond strength of 35 kgf was obtained at the brazing condition of 900℃/1800sec with AT alloy. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the TiN layer and AlN. |
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