발간논문

Home > KJMM 논문 > 발간논문

Vol.33, No.8, 1075 ~ 1083, 1995
Title
A Study on Wetting Behavior and Interfacial Reaction with Sn Content in Sn - Bi Solder
이경구Kyung Ku Lee, 이재진Jae Jin Lee, 이도재Doh Jae Lee
Abstract
Solderability and interfacial reaction between Cu-substrate and Sn-Bi solder were studied. Experimental variables included Sn contents, types of flux and soldering temperature. Some solder joints are subjected to aging treatments for up to 90 days to see interfacial reaction at 100℃. Analysing the experimental result concerning solderability, it was found that the role of Sn contents is increasing spread area on Cu substrate during soldering. A similar effect is observed by increasing soldering temperature and using activated flux(RMA flux) instead of using non-activated flux(R flux). According to the result of EDXS(Energy Dispersive X-ray Spectrometer), it is supposed that the soldered interfacial zone was composed of Cu₃Sn and Cu_6Sn_6. Those intermetallic compound formed in interfacial zone changed entirely to Cu₃Sn after 5days annealing at 100℃.
Key Words
| PDF
대한금속∙재료학회 │ (06633) 서울시 서초구 서초대로 56길 38 대한금속∙재료학회 회관 (서초1동 1666-12번지)
Tel : 070-4266-1646 │ FAX : 02-557-1080 │ E-mail : metal@kim.or.kr
Copyright ⓒ 2013 사단법인 대한금속∙재료학회 All rights reserved.