A Study on the Fabrication of SiCp / Mg Alloy Composites
이준서Joon Seo Lee, 이두면Doo Myun Lee, 이지환Chi Hwan Lee
Abstract
The aim of this paper was to optimize the fabrication of SiC_P/Mg alloy composite using AZ91D Mg alloy machined chips which have the difficulty of the recycling. The mixtures of Mg alloy machined chips and SiC particles were consolidated by vacuum hot pressing(pressing pressure : 100MPa, pressing temperature : 410℃). Extrusion was conducted at 300℃ with ram speed of 13㎝/min under hot extrusion ratios 25 : 1 and 40 : 1. Tε treatment was performed up to 150h at 170℃ after extrusion. Mg alloy chips was also extruded and heat-treated at the same condition as a reference material. Microstructural observation and tensile test were carried out to investigate the effects of extrusion on the microstructure and mechanical property of the composite. Microstructural observation showed that both extruded composite and extruded Mg alloy chips have fine grain sizes due to dynamic recrystallization during hot extrusion. It has been observed that tensile strength of extruded composite is superior than that of extruded Mg alloy machined chips. This may be attributable to the effect of SiC particles and the fine grain size along the periphery of SiC particle. In the T_6 condition, extruded Mg machined chips showed a small decrease of tensffe strength, whereas extruded composite showed an increase of tensile strength. This may be because SiC particles restricted the grain growth of the Mg matrix during solution treatment.