발간논문

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Vol.32, No.2, 224 ~ 233, 1994
Title
A Study of interfacial Structure and Bond Strength of Si3N4 / Ni - Cr Steel Joint
김종헌Jong Heon Kim, 우정택Jeong Tag Woo, 유연철Yeon Chul Yoo
Abstract
Silicon Nitride(Si₃N₄) and Ni-Cr steel were bonded by using Ti/Cu laminate layer and the interfacial structure along with mechanical properties were investigated. It could be shown that the reaction products formed at Si₃N₄/Ti interface were TiN and Ti-silicide. The thickness of reaction product layer formed at Si₃N₄/Ti interface was almost constant, independent on bonding condition. However room temperature bond strength was affected strongly by the thickness of Ti/Cu reaction layer and decrease of copper layer due to press in high bonding temperature. Bond strength according to testing temperature was similiar to room temperature value (162MPa) to 400℃, while above 400℃ it was decreased abrubtly due to softening of copper layer. In this study, dominant factors controlling mechanical properties of the joint were the extent of the reaction between Ti and Cu and the change of copper layer thickness.
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