발간논문

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Vol.32, No.1, 97 ~ 104, 1994
Title
Application of an Electroless Copper Coating in Acidic Bath to Preparation of the metal hydride electrode
최전Jeon Choi, 박충년Choong Nyeon Park
Abstract
Electroless copper plating method was employed in copper coating of the (LM)Ni_(4.5)Co_(0.1)Mn_(0.2)Al_(0.2) hydrogen storage alloy powders for the preparation of a hydride electrode by using an acidic bath containing only CuSO₄ and H₂SO₄. The coating characteristics and the electrode properties were examined by SEM, X-ray photoelectron spectroscopy and electrochemical measurements in a half cell. The coating was being performed very fast within 5 min. without any pretreatment at room temperature. It was shown that the maximum discharge capacity was 250mAh/g in all electrodes and was degraded with increasing number of cycles. As the alloy powder used was finer, the electrode reaction was faster. However the degradation of electrode was larger. It can be suggested that this electroless copper plating method could be applied to the preparation of the rare earth-nickel based alloy electrode.
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