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Vol.31, No.3, 323 ~ 330, 1993
Title
A Study on the Melting induced Diffusion bonding of 304 stainless steel
정재필J . P . Jung, 이충도C . D . Lee, 강춘식C . S . Kang
Abstract
A new diffusion bonding method (named as Melting Induced Diffusion(MID) bonding) which aimed to make better Transient Liquid Phase(TLP) bonding was developed and applied to the bonding of 304/304 stainless steel. In this research boron powder was used as a insert metal. The width of reacted layer of the bonded joint had linear relationship with square root of bonding time. And the bonded ratio of the joint increased with bonding time. As a result of tension test, tensile strength far room temperature were about 200㎫.
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